With a rectangular smd exposed inside a big cooper plane. When i try to connect the component, the only connection possible is to I have drawn the shape in top, stop mask and cream mask layers. Rectangular pad, even though the image shows a different footprint). (I dont know if i just should make a giant
Make the footprint of an inductor (below i include image) so I need thisĪrea to be exposed. Yes, the stop masks is what makes the copper exposed.
Shapes library for autodesk graphic manual#
With the manual addition of cream and stop masks, should I expect anĮxposed irregular pad in my final PCB after manufacturing? You did not mention the version you areĬurrently using, but I'ld recommend our current beta 6.1.3. Keep in mind that it is possible to switch offĪutomatic generation of mask data in the SMD properties (CreamĬoncerning the layer problem: It mightbe the case that there is a If this is not what you would like to have, simplyĭraw the mask manually. Mask data will be generated automatically for As we agreed uponĭefining packages always on the top side of a board, the layer we have Check the cream frame (solder paste mask)ĭisplay layers 31, tCream and 32, bCream for this. If you want to have the area notĬovered by solder stop lacquer, draw it manually in the appropriate Mask data will be generated for the PAD/SMD area only. You have to draw thisĪrea in any signal layer you plan to use. Start the wire in the origin of the PAD/SMD. Wire width for the polygon, which fulfils the Design Rules. That polygon is not recognized as a part to the pad. The PAD/SMDs center must be inside the polygon's area. For a PAD you have to draw the final shape in all the layers you plan Use POLYGON to draw the final pad shape The typical way to draw an arbitrary pads shape is:
Shapes library for autodesk graphic how to#
Information for evaluation, but may I simply add a test taken from theĮAGLE manual in order to explain how to do this. Tried to define arbitrary pad shapes, the images don't have enough I looked into theĮlement14 page and checked the images there.
cmp = top, pads and vias.sol = bottom, pads and vias.Īgain the images didn't make it to the nntp forum. I have checked the layer selections on the CAM processor and everything looks ok. Hmm, seems I can attach a file so I will have to insert it. I can't see that this is a problem as the pads that are hidden inside the polygons do appear on the bottom layer, just the poly's that are wrong The component package was created on the top layer only. However, when I export the Gerber files (using RS247X) all of my 'custom pad' shapes appear on the top layer, even though they are clearly set to the bottom layer.jpg's attached for clarification.
I have added tStop and tRestrict layers and that has solved most of the problems. Ok, I see that there is no way to turn a polygon into a pad.
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